Invention Grant
- Patent Title: Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications
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Application No.: US18224794Application Date: 2023-07-21
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Publication No.: US12087695B2Publication Date: 2024-09-10
- Inventor: Srinivas Pietambaram , Rahul Manepalli , Gang Duan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L23/00 ; H01L23/31 ; H01L25/00 ; H01L25/065
Abstract:
Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, a microelectronic device package may include a redistribution layer (RDL) and an interposer over the RDL. In an embodiment, a glass core may be formed over the RDL and surround the interposer. In an embodiment, the microelectronic device package may further comprise a plurality of dies over the interposer. In an embodiment, the plurality of dies are communicatively coupled with the interposer.
Public/Granted literature
- US20230361044A1 HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENEOUS DIE INTEGRATION APPLICATIONS Public/Granted day:2023-11-09
Information query
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