Invention Grant
- Patent Title: Wire bonding apparatus, method for measuring opening amount of clamp apparatus, and method for calibrating clamp apparatus
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Application No.: US17603584Application Date: 2020-09-04
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Publication No.: US12087725B2Publication Date: 2024-09-10
- Inventor: Toshihiko Toyama
- Applicant: SHINKAWA LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINKAWA LTD.
- Current Assignee: SHINKAWA LTD.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- International Application: PCT/JP2020/033585 2020.09.04
- International Announcement: WO2022/049721A 2022.03.10
- Date entered country: 2021-10-14
- Main IPC: B23K20/00
- IPC: B23K20/00 ; H01L23/00

Abstract:
A wire bonding apparatus of an aspect includes: a clamp apparatus, having a pair of arms; a stage, moving the clamp apparatus in a horizontal direction; a rod member; a contact detection part, detecting contact between the rod member and the clamp apparatus; and a control apparatus, controlling opening and closing of the pair of arms and an operation of the stage and acquiring position information of the clamp apparatus. The control apparatus obtains an opening amount of the pair of arms based on position information of the clamp apparatus at a time when an outer side surface of a first arm contacts the rod member in a state where the pair of arms are closed and position information of the clamp apparatus at the time when the outer side surface of the first arm contacts the rod member in a state where the pair of arms are open.
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