Invention Grant
- Patent Title: Shape-memory alloy and shape-memory alloy wire
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Application No.: US16968764Application Date: 2019-02-28
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Publication No.: US12104236B2Publication Date: 2024-10-01
- Inventor: Hideki Hosoda , Akira Umise , Kenji Goto
- Applicant: TOKYO INSTITUTE OF TECHNOLOGY , TANAKA KIKINZOKU KOGYO K.K.
- Applicant Address: JP Tokyo
- Assignee: TOKYO INSTITUTE OF TECHNOLOGY and,TANAKA KIKINZOKU KOGYO K.K.
- Current Assignee: TOKYO INSTITUTE OF TECHNOLOGY and,TANAKA KIKINZOKU KOGYO K.K.
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 18037895 2018.03.02
- International Application: PCT/JP2019/007752 2019.02.28
- International Announcement: WO2019/168081A 2019.09.06
- Date entered country: 2020-08-10
- Main IPC: C22F1/00
- IPC: C22F1/00 ; A61L27/04 ; A61L27/50 ; A61L29/02 ; A61L29/14 ; A61L31/02 ; A61L31/14 ; C22C5/02 ; C22F1/14

Abstract:
The present invention provides a shape-memory alloy including a Au—Cu—Al alloy having 20 at % or more and 40 at % or less Cu and 15 at % or more and 30 at % or less Al, with the balance being Au and inevitable impurities. The shape-memory alloy has a Vickers hardness of 360 Hv or less. The Au—Cu—Al alloy of the present invention is an alloy capable of developing both biocompatibility and a shape-memory effect, and further capable of achieving artifactlessness in a magnetic environment. The Au—Cu—Al alloy can be produced by heat-treating a clad material formed of a combination of a hollow material made of a Au—Cu alloy and a core material made of metallic Al at 500° C. or more and 700° C. or less.
Public/Granted literature
- US20210010120A1 SHAPE-MEMORY ALLOY AND SHAPE-MEMORY ALLOY WIRE Public/Granted day:2021-01-14
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