Invention Grant
- Patent Title: Semiconductor structure, HEMT structure and method of forming the same
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Application No.: US18067733Application Date: 2022-12-19
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Publication No.: US12107156B2Publication Date: 2024-10-01
- Inventor: Yao-Chung Chang , Po-Chih Chen , Jiun-Lei Jerry Yu , Chun Lin Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- The original application number of the division: US15172775 2016.06.03
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L21/324 ; H01L29/20 ; H01L29/201 ; H01L29/51 ; H01L29/66

Abstract:
A semiconductor structure includes: a channel layer; an active layer over the channel layer, wherein the active layer is configured to form a two-dimensional electron gas (2DEG) to be formed in the channel layer along an interface between the channel layer and the active layer; a gate electrode over a top surface of the active layer; and a source/drain electrode over the top surface of the active layer; wherein the active layer includes a first layer and a second layer sequentially disposed therein from the top surface to a bottom surface of the active layer, and the first layer possesses a higher aluminum (Al) atom concentration compared to the second layer. An HEMT structure and an associated method are also disclosed.
Public/Granted literature
- US20230123907A1 SEMICONDUCTOR STRUCTURE, HEMT STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2023-04-20
Information query
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