Invention Grant
- Patent Title: Resin multilayer substrate and method for manufacturing resin multilayer substrate
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Application No.: US17584589Application Date: 2022-01-26
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Publication No.: US12120817B2Publication Date: 2024-10-15
- Inventor: Ryosuke Takada , Michiharu Nishimura
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: ArentFox Schiff LLP
- Priority: JP 19144542 2019.08.06
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B32B3/26 ; B32B27/08 ; C08J5/04 ; C08J5/18 ; H05K1/02 ; H05K3/46 ; H05K1/11

Abstract:
A resin multilayer substrate that includes a substrate having a plurality of laminated resin layers containing a norbornene-based polymer. A resin layer has an altered portion altered by a surface treatment and formed at an interface with a resin layer adjacent thereto in a lamination direction. An adhesion at an interface having the altered portion is greater than an adhesion at an interface with a non-altered portion.
Public/Granted literature
- US20220151066A1 RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTILAYER SUBSTRATE Public/Granted day:2022-05-12
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