Invention Grant
- Patent Title: Arrays of double-sided dram cells including capacitors on the frontside and backside of a stacked transistor structure
-
Application No.: US17132981Application Date: 2020-12-23
-
Publication No.: US12120865B2Publication Date: 2024-10-15
- Inventor: Cheng-Ying Huang , Ashish Agrawal , Gilbert Dewey , Abhishek A. Sharma , Wilfred Gomes , Jack Kavalieros
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L21/683 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786 ; H10B53/30

Abstract:
Monolithic two-dimensional (2D) arrays of double-sided DRAM cells including a frontside bit cell over a backside bit cell. Each double-sided cell includes a stacked transistor structure having at least a first transistor over a second transistor. Each double-sided cell further includes a first capacitor on a frontside of the stacked transistor structure and electrically coupled to a source/drain of the first transistor. Each double-sided cell further includes a second capacitor on a backside of the stacked transistor structure and electrically coupled to a source/drain of the second transistor. Frontside cell addressing interconnects are electrically coupled to other terminals of at least the first transistor while one or more backside addressing interconnects are electrically coupled to at least one terminal of the second transistor or second capacitor.
Public/Granted literature
Information query