Invention Grant
- Patent Title: Cold plate architecture for liquid cooling of devices
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Application No.: US17123760Application Date: 2020-12-16
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Publication No.: US12133357B2Publication Date: 2024-10-29
- Inventor: Jin Yang , David Shia , Mohanraj Prabhugoud , Olaotan Elenitoba-Johnson , Craig Jahne , Phil Geng
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight & Zimmerman, LLC
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.
Public/Granted literature
- US20210105911A1 COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES Public/Granted day:2021-04-08
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