公开(公告)号：US11842943B2

公开(公告)日：2023-12-12

申请号：US16986122

申请日：2020-08-05

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L. Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Fernando Gonzalez Lenero ,  Carlos Alvizo Flores

IPC: H01L23/367 ,  H05K7/20 ,  H05K7/14 ,  G11C5/06

CPC classification number: H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

公开(公告)号：US20190281719A1

公开(公告)日：2019-09-12

申请号：US16422854

申请日：2019-05-24

Applicant: Intel Corporation

Inventor： Phil Geng ,  George Vergis ,  Xiang Li

IPC: H05K7/12 ,  H05K1/11 ,  H05K7/14 ,  H05K7/10

Abstract: Embodiments are directed towards apparatuses, methods, and systems for a memory module, e.g., a dual in-line memory module (DIMM) including a first lengthwise edge along the DIMM and a second lengthwise edge, opposite the first lengthwise edge, to couple the DIMM with a printed circuit board (PCB). In embodiments, the DIMM includes one or more notches along the first lengthwise edge, to removeably couple with one or more flexible supports located at least partially along a length or width of a chassis and to engage the notches to assist in retention of the DIMM in the chassis to reduce a shock and/or vibration associated with a load of a plurality of DIMMs on the PCB. In some embodiments, the one or more flexible supports are coupled to a support structure, such as a pole mounted or otherwise coupled to a panel of the chassis. Additional embodiments may be described and claimed.

公开(公告)号：US20190165503A1

公开(公告)日：2019-05-30

申请号：US16264944

申请日：2019-02-01

Applicant: Intel Corporation

Inventor： Phil Geng ,  Xiang Li ,  George Vergis ,  Mani Prakash

IPC: H01R12/70 ,  H01R12/73

Abstract: An embodiment of a connector housing for a circuit board may include a connector body to receive the circuit board, and a relaxation mechanism mechanically coupled to the connector body to relax stress on the connector housing and maintain the circuit board received in the connector body under a load which exceeds a load threshold. Other embodiments are disclosed and claimed.

公开(公告)号：US12131977B2

公开(公告)日：2024-10-29

申请号：US18498891

申请日：2023-10-31

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Carlos Alvizo Flores ,  Fernando Gonzalez Lenero

IPC: H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

CPC classification number: H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

公开(公告)号：US20240113479A1

公开(公告)日：2024-04-04

申请号：US17957761

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Kai Xiao ,  Phil Geng ,  Carlos Alberto Lizalde Moreno ,  Raul Enriquez Shibayama ,  Steven A. Klein

IPC: H01R13/6597 ,  H01R12/71 ,  H01R13/50 ,  H01R13/6471 ,  H01R33/74 ,  H01R43/18 ,  H01R43/20

CPC classification number: H01R13/6597 ,  H01R12/714 ,  H01R13/50 ,  H01R13/6471 ,  H01R33/74 ,  H01R43/18 ,  H01R43/20 ,  H01R12/57

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for socket interconnect structures and related methods. An example socket interconnect apparatus includes a housing defining a plurality of first openings and a plurality of second openings and a ground structure coupled to the housing. The ground structure defines a plurality of third openings. The third openings of the ground structure align with the second openings of the housing when the ground structure is coupled to the housing. A plurality of ground pins are located in respective ones of the second openings and third openings. The ground structure is to electrically couple the ground pins. A plurality of signal pins are located in respective ones of the first openings of the housing. The signal pins are electrically isolated from the ground structure.

公开(公告)号：US20230038805A1

公开(公告)日：2023-02-09

申请号：US17956624

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Phil Geng ,  David Shia ,  Ralph Miele ,  Sandeep Ahuja ,  Jeffory Smalley

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/40

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.

公开(公告)号：US10790603B2

公开(公告)日：2020-09-29

申请号：US16264944

申请日：2019-02-01

Applicant: Intel Corporation

Inventor： Phil Geng ,  Xiang Li ,  George Vergis ,  Mani Prakash

IPC: H01R12/70 ,  H01R12/73

Abstract: An embodiment of a connector housing for a circuit board may include a connector body to receive the circuit board, and a relaxation mechanism mechanically coupled to the connector body to relax stress on the connector housing and maintain the circuit board received in the connector body under a load which exceeds a load threshold. Other embodiments are disclosed and claimed.

公开(公告)号：US20190044262A1

公开(公告)日：2019-02-07

申请号：US16021269

申请日：2018-06-28

Applicant: Intel Corporation

Inventor： Phil Geng ,  Xiang Li ,  Mani Prakash ,  George Vergis

IPC: H01R12/70 ,  H05K1/14 ,  H01R12/73

Abstract: A memory module connector includes a memory module receiving slot configured to receive a memory module. The memory module connector further includes a restraining mechanism configured to release the memory module if a force applied by the memory module to the restraining mechanism is above a pre-determined force threshold.

公开(公告)号：US20250071924A1

公开(公告)日：2025-02-27

申请号：US18940819

申请日：2024-11-07

Applicant: Intel Corporation

Inventor： Phil Geng ,  David Shia ,  Xiang Li ,  George Vergis ,  Ralph Miele ,  Sanjoy Saha ,  Jeffory Smalley

IPC: H05K7/14

Abstract: Methods and apparatus relating to tall Dual Inline Memory Module (DIMM) structural retention are described. In one embodiment, a Dual In-Line Memory Module (DIMM) retention frame is coupled to a top portion of a tall (e.g., “two unit” or taller) DIMM. A plurality of fasteners physically attach the DIMM retention frame to a Printed Circuit Board (PCB). The DIMM retention frame reduces movement of the tall DIMM. Other embodiments are also claimed and disclosed.

公开(公告)号：US20240413054A1

公开(公告)日：2024-12-12

申请号：US18810136

申请日：2024-08-20

Applicant: Intel Corporation

Inventor： Min Pei ,  Ralph V. Miele ,  Lejie Liu ,  Phil Geng ,  Caleb Million Tessema

IPC: H01L23/467 ,  H01L23/367 ,  H01L23/40

Abstract: Integrated circuit packages with fluid spacers to improve pin load distribution are disclosed. An example apparatus includes an integrated circuit (IC) package, a circuit board, a socket to couple the IC package and the circuit board, a backplate coupled to the circuit board, a loading assembly to provide a stack load to the IC package, and a fluid liner positioned between the circuit board and the backplate.