Invention Grant
- Patent Title: Diode array
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Application No.: US18481334Application Date: 2023-10-05
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Publication No.: US12136686B2Publication Date: 2024-11-05
- Inventor: Hung-Cheng Lin , Hung-Kuang Hsu , Hua-Chen Hsu
- Applicant: Visionlabs Corporation
- Applicant Address: TW Taipei
- Assignee: Visionlabs Corporation
- Current Assignee: Visionlabs Corporation
- Current Assignee Address: TW Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW109117578 20200527
- Main IPC: H01L33/14
- IPC: H01L33/14 ; H01L25/075 ; H01L25/16 ; H01L33/00 ; H01L33/38

Abstract:
A diode array includes a substrate and a plurality of light emitting diodes disposed on the substrate and arranged in an array. Each of the light emitting diodes includes a stack of functional layers includes a first semiconductor layer, a second semiconductor layer, and a light emitting layer located between the first semiconductor layer and the second semiconductor layer. At least one of the light emitting diodes includes a first current limiting region covering at least a portion of the first semiconductor layer, the light emitting layer or the second semiconductor layer; a first electrode electrically connected to the first semiconductor layer; and a second electrode electrically connected to the second semiconductor layer, wherein the first electrode and the second electrode are disposed at the same side of the first semiconductor layer.
Public/Granted literature
- US20240047609A1 DIODE ARRAY Public/Granted day:2024-02-08
Information query
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