Invention Publication
- Patent Title: DIODE ARRAY
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Application No.: US18481334Application Date: 2023-10-05
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Publication No.: US20240047609A1Publication Date: 2024-02-08
- Inventor: HUNG-CHENG LIN , HUNG-KUANG HSU , HUA-CHEN HSU
- Applicant: Visionlabs Corporation
- Applicant Address: TW Taipei City
- Assignee: Visionlabs Corporation
- Current Assignee: Visionlabs Corporation
- Current Assignee Address: TW Taipei City
- Priority: TW 9117578 2020.05.27
- Main IPC: H01L33/14
- IPC: H01L33/14 ; H01L25/075 ; H01L25/16 ; H01L33/00

Abstract:
A diode array includes a substrate and a plurality of light emitting diodes disposed on the substrate and arranged in an array. Each of the light emitting diodes includes a stack of functional layers includes a first semiconductor layer, a second semiconductor layer, and a light emitting layer located between the first semiconductor layer and the second semiconductor layer. At least one of the light emitting diodes includes a first current limiting region covering at least a portion of the first semiconductor layer, the light emitting layer or the second semiconductor layer; a first electrode electrically connected to the first semiconductor layer; and a second electrode electrically connected to the second semiconductor layer, wherein the first electrode and the second electrode are disposed at the same side of the first semiconductor layer.
Public/Granted literature
- US12136686B2 Diode array Public/Granted day:2024-11-05
Information query
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