Invention Grant
- Patent Title: Cooling system and electronic device
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Application No.: US17768301Application Date: 2020-10-30
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Publication No.: US12137538B2Publication Date: 2024-11-05
- Inventor: Yasuhito Nakamura
- Applicant: NEC Platforms, Ltd.
- Applicant Address: JP Kawasaki
- Assignee: NEC Platforms, Ltd.
- Current Assignee: NEC Platforms, Ltd.
- Current Assignee Address: JP Kawasaki
- Priority: JP2019-205338 20191113
- International Application: PCT/JP2020/040862 WO 20201030
- International Announcement: WO2021/095569 WO 20210520
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A cooling system includes a first module, a second module provided at a different position in a depth direction of a housing with respect to the first module, a third module provided at a different position in a width direction of the housing with respect to the first module and the second module, an upstream side tube configured to supply a cooling medium to a cooling member of the first module, a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to a cooling member of the second module, and a branch tube configured to branch from the downstream side tube and supply the cooling medium to a cooling member of the third module.
Public/Granted literature
- US20240107708A1 COOLING SYSTEM AND ELECTRONIC DEVICE Public/Granted day:2024-03-28
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