Invention Publication
- Patent Title: COOLING SYSTEM AND ELECTRONIC DEVICE
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Application No.: US17768301Application Date: 2020-10-30
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Publication No.: US20240107708A1Publication Date: 2024-03-28
- Inventor: Yasuhito NAKAMURA
- Applicant: NEC Platforms, Ltd.
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: NEC Platforms, Ltd.
- Current Assignee: NEC Platforms, Ltd.
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Priority: JP 19205338 2019.11.13
- International Application: PCT/JP2020/040862 2020.10.30
- Date entered country: 2022-04-12
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A cooling system includes a first module, a second module provided at a different position in a depth direction of a housing with respect to the first module, a third module provided at a different position in a width direction of the housing with respect to the first module and the second module, an upstream side tube configured to supply a cooling medium to a cooling member of the first module, a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to a cooling member of the second module, and a branch tube configured to branch from the downstream side tube and supply the cooling medium to a cooling member of the third module.
Public/Granted literature
- US12137538B2 Cooling system and electronic device Public/Granted day:2024-11-05
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