• Patent Title: COOLING SYSTEM AND ELECTRONIC DEVICE
  • Application No.: US17768301
    Application Date: 2020-10-30
  • Publication No.: US20240107708A1
    Publication Date: 2024-03-28
  • Inventor: Yasuhito NAKAMURA
  • Applicant: NEC Platforms, Ltd.
  • Applicant Address: JP Kawasaki-shi, Kanagawa
  • Assignee: NEC Platforms, Ltd.
  • Current Assignee: NEC Platforms, Ltd.
  • Current Assignee Address: JP Kawasaki-shi, Kanagawa
  • Priority: JP 19205338 2019.11.13
  • International Application: PCT/JP2020/040862 2020.10.30
  • Date entered country: 2022-04-12
  • Main IPC: H05K7/20
  • IPC: H05K7/20
COOLING SYSTEM AND ELECTRONIC DEVICE
Abstract:
A cooling system includes a first module, a second module provided at a different position in a depth direction of a housing with respect to the first module, a third module provided at a different position in a width direction of the housing with respect to the first module and the second module, an upstream side tube configured to supply a cooling medium to a cooling member of the first module, a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to a cooling member of the second module, and a branch tube configured to branch from the downstream side tube and supply the cooling medium to a cooling member of the third module.
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