Invention Grant
- Patent Title: Semiconductor die for controlling on-die-termination of another semiconductor die, and semiconductor devices including the same
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Application No.: US18154945Application Date: 2023-01-16
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Publication No.: US12142314B2Publication Date: 2024-11-12
- Inventor: Taeyoung Oh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2022-0048958 20220420,KR10-2022-0079252 20220628
- Main IPC: G11C11/4097
- IPC: G11C11/4097 ; G11C7/10 ; G11C11/4076 ; G11C11/4093 ; H01L23/48 ; H03K19/0175 ; H10B80/00
Abstract:
A semiconductor die includes a first pin configured to output a first on-die termination (ODT) control signal to a second semiconductor die, the second semiconductor die comprising a plurality of second ODT circuits each having an ODT that is responsive to the first ODT control signal; and a second pin configured to receive a second ODT control signal output from the second semiconductor die, the semiconductor die comprising a plurality of first ODT circuits each having an ODT that is responsive to the second ODT control signal.
Public/Granted literature
Information query
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