Invention Publication
- Patent Title: SEMICONDUCTOR DIE FOR CONTROLLING ON-DIE-TERMINATION OF ANOTHER SEMICONDUCTOR DIE, AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
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Application No.: US18154945Application Date: 2023-01-16
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Publication No.: US20230343386A1Publication Date: 2023-10-26
- Inventor: TAEYOUNG OH
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220048958 2022.04.20 KR 20220079252 2022.06.28
- Main IPC: G11C11/4093
- IPC: G11C11/4093 ; G11C7/10 ; H03K19/0175 ; G11C11/4076 ; H10B80/00 ; H01L23/48
Abstract:
A semiconductor die includes a first pin configured to output a first on-die termination (ODT) control signal to a second semiconductor die, the second semiconductor die comprising a plurality of second ODT circuits each having an ODT that is responsive to the first ODT control signal; and a second pin configured to receive a second ODT control signal output from the second semiconductor die, the semiconductor die comprising a plurality of first ODT circuits each having an ODT that is responsive to the second ODT control signal.
Public/Granted literature
Information query
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