Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US15930561Application Date: 2020-05-13
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Publication No.: US12142496B2Publication Date: 2024-11-12
- Inventor: Yoshifumi Amano , Kazuhiro Aiura
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2019-091600 20190514
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B05B9/00 ; B05C5/02 ; B05C11/10 ; H01L21/68
Abstract:
A substrate processing apparatus includes a holder, a nozzle arm and a position adjusting device. The holder is configured to hold a substrate. The nozzle arm has a nozzle configured to supply a processing liquid to a peripheral portion of the substrate. The position adjusting device is provided at the nozzle arm and is configured to adjust a position of the substrate to a given position on the holder.
Public/Granted literature
- US3179827A Motor mounts for pitless well construction Public/Granted day:1965-04-20
Information query
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