Invention Grant
- Patent Title: Processing apparatus and workpiece processing method
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Application No.: US17836618Application Date: 2022-06-09
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Publication No.: US12148649B2Publication Date: 2024-11-19
- Inventor: Yukiyasu Masuda , Kentaro Odanaka
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: GREER BURNS & CRAIN, LTD.
- Priority: JP2019-079162 20190418
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/67 ; H01L21/683

Abstract:
A workpiece processing method for processing a workpiece using a processing apparatus including a chuck table, a processing unit, a moving mechanism for moving the chuck table and the processing unit relative to each other, and an imaging unit for imaging the workpiece, where the chuck table includes a holding member formed by a transparent body and a supporting member supporting a part of the holding member and connected to an angle control mechanism. The method includes a tape affixing step, a holding step of holding the workpiece by the chuck table via the tape, and an identifying step of imaging the top surface side of the workpiece through the transparent holding member by the imaging unit positioned in a region that is on a lower side of the holding member and is not superimposed on the supporting member, and identifying a region to be processed in the workpiece.
Public/Granted literature
- US20220301918A1 PROCESSING APPARATUS AND WORKPIECE PROCESSING METHOD Public/Granted day:2022-09-22
Information query
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