Invention Grant
- Patent Title: Method for producing lamella, analysis system and method for analyzing sample
-
Application No.: US17773433Application Date: 2019-11-20
-
Publication No.: US12176180B2Publication Date: 2024-12-24
- Inventor: Atsushi Sawada , Tsunenori Nomaguchi
- Applicant: Hitachi High-Tech Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Tech Corporation
- Current Assignee: Hitachi High-Tech Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- International Application: PCT/JP2019/045433 WO 20191120
- International Announcement: WO2021/100144 WO 20210527
- Main IPC: H01J37/20
- IPC: H01J37/20 ; H01J37/26 ; H01J37/30 ; H01J37/305
Abstract:
A lamella 10 including an analysis portion 11 and a cutout portion 12 separated from the analysis portion 11 is produced. When a plurality of the lamellae 10 are transported to a lamella grid 20, the plurality of lamellae 10 are supported by a support portion 22 protruding from a surface of a substrate 21, and are mounted adjacent to each other in a Z direction. At this time, the cutout portion 12 prevents the analysis portion 11 from damage.
Public/Granted literature
- US20220367144A1 Method for Producing Lamella, Analysis System and Method for Analyzing Sample Public/Granted day:2022-11-17
Information query
