A back cover heat dissipation structure of a laptop includes a radio frequency tag module, a back cover, and a metal foil. The radio frequency tag module includes a circuit board with a component region and an antenna region. The component region and the antenna region are disposed on a bottom side and a top side of the circuit board, respectively. The back cover includes a plating region and a receiving chamber. The receiving chamber receives the radio frequency tag module. The top side of the circuit board is attached to the bottom of the receiving chamber. The metal foil not only covers the bottom side of the circuit board but also extends to cover the plating region. Therefore, not only is heat dissipation achieved, the impedance of components on the circuit board can also be adjusted to optimize the sensing capability of the radio frequency tag module.