- Patent Title: High-temperature substrate support assembly with failure protection
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Application No.: US18197657Application Date: 2023-05-15
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Publication No.: US12185433B2Publication Date: 2024-12-31
- Inventor: Denis Martin Koosau , Suresh Gupta , Martin Perez-Guzman , Ashish Goel
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: LOWENSTEIN SANDLER LLP
- Priority: IN202241028214 20220517
- Main IPC: H05B3/26
- IPC: H05B3/26 ; H01L21/67 ; H01L21/683

Abstract:
A substrate support assembly includes a plate structure and an insulator structure. The plate structure includes an upper plate and a lower plate. The lower plate includes a lower plate structure surface. The insulator structure is disposed beneath the plate structure. The insulator structure includes a lower insulator structure surface and an upper insulator structure surface. A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface. The first portion of the upper insulator structure surface forms an interior volume with the lower plate structure surface.
Public/Granted literature
- US20230377930A1 HIGH-TEMPERATURE SUBSTRATE SUPPORT ASSEMBLY WITH FAILURE PROTECTION Public/Granted day:2023-11-23
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