公开(公告)号：US12185433B2

公开(公告)日：2024-12-31

申请号：US18197657

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Denis Martin Koosau ,  Suresh Gupta ,  Martin Perez-Guzman ,  Ashish Goel

IPC: H05B3/26 ,  H01L21/67 ,  H01L21/683

Abstract: A substrate support assembly includes a plate structure and an insulator structure. The plate structure includes an upper plate and a lower plate. The lower plate includes a lower plate structure surface. The insulator structure is disposed beneath the plate structure. The insulator structure includes a lower insulator structure surface and an upper insulator structure surface. A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface. The first portion of the upper insulator structure surface forms an interior volume with the lower plate structure surface.

公开(公告)号：US10964584B2

公开(公告)日：2021-03-30

申请号：US16417369

申请日：2019-05-20

Applicant: Applied Materials, Inc.

Inventor： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC: H01L21/68 ,  H01L21/687 ,  H01L21/683 ,  H01L21/677

Abstract: A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.

公开(公告)号：US20230377930A1

公开(公告)日：2023-11-23

申请号：US18197657

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Denis Martin Koosau ,  Suresh Gupta ,  Martin Perez-Guzman ,  Ashish Goel

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: A substrate support assembly includes a plate structure and an insulator structure. The plate structure includes an upper plate and a lower plate. The lower plate includes a lower plate structure surface. The insulator structure is disposed beneath the plate structure. The insulator structure includes a lower insulator structure surface and an upper insulator structure surface. A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface. The first portion of the upper insulator structure surface forms an interior volume with the lower plate structure surface.

公开(公告)号：US11842917B2

公开(公告)日：2023-12-12

申请号：US17216439

申请日：2021-03-29

Applicant: Applied Materials, Inc.

Inventor： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC: H01L21/68 ,  H01L21/687 ,  H01L21/683 ,  H01L21/677

CPC classification number: H01L21/68735 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68742 ,  H01L21/677

Abstract: A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.

公开(公告)号：US20210217650A1

公开(公告)日：2021-07-15

申请号：US17216439

申请日：2021-03-29

Applicant: Applied Materials, Inc.

Inventor： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC: H01L21/687 ,  H01L21/68 ,  H01L21/683

Abstract: A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.

公开(公告)号：US12148645B2

公开(公告)日：2024-11-19

申请号：US18435175

申请日：2024-02-07

Applicant: Applied Materials, Inc.

Inventor： Andrew Myles ,  Denis Martin Koosau ,  Peter Muraoka ,  Phillip Criminale

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/687

Abstract: Apparatus and methods for calibrating a height-adjustable edge ring are described herein. In one example, a calibration jig for positioning an edge ring relative to a reference surface is provided that includes a transparent plate, a plurality of sensors coupled to a first side of the transparent plate, and a plurality of contact pads coupled to an opposing second side of the transparent plate.

公开(公告)号：US20230380016A1

公开(公告)日：2023-11-23

申请号：US18197658

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Denis Martin Koosau ,  Suresh Gupta ,  Martin Perez-Guzman ,  Ashish Goel

IPC: H05B3/26

CPC classification number: H05B3/265

Abstract: A substrate support assembly includes a puck, comprising a heating element, a power distribution assembly, and an insulator comprising at least one of alumina or thermoplastic disposed between the puck and the power distribution assembly, wherein an electrical connection between the heating element and the power distribution assembly comprises a terminal and a conical washer.

公开(公告)号：US20200373194A1

公开(公告)日：2020-11-26

申请号：US16417369

申请日：2019-05-20

Applicant: Applied Materials, Inc.

Inventor： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/68

Abstract: A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.