Invention Grant
- Patent Title: Covers for semiconductor package components
-
Application No.: US18484321Application Date: 2023-10-10
-
Publication No.: US12198995B2Publication Date: 2025-01-14
- Inventor: Sreenivasan Kalyani Koduri , Leslie Edward Stark
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- Main IPC: H01L23/06
- IPC: H01L23/06 ; H01L21/56 ; H01L23/00 ; H01L23/16 ; H01L23/31 ; H01L23/495
Abstract:
In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.
Public/Granted literature
- US20240038609A1 COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS Public/Granted day:2024-02-01
Information query
IPC分类:
