Invention Publication
- Patent Title: COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
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Application No.: US18484321Application Date: 2023-10-10
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Publication No.: US20240038609A1Publication Date: 2024-02-01
- Inventor: Sreenivasan Kalyani KODURI , Leslie Edward STARK
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/16
- IPC: H01L23/16 ; H01L23/31 ; H01L21/56 ; H01L23/00
Abstract:
In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.
Public/Granted literature
- US12198995B2 Covers for semiconductor package components Public/Granted day:2025-01-14
Information query
IPC分类:
