Invention Grant
- Patent Title: Semiconductor module
-
Application No.: US18159644Application Date: 2023-01-25
-
Publication No.: US12199022B2Publication Date: 2025-01-14
- Inventor: Masayoshi Nakazawa
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: JP2021-020737 20210212
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/538 ; H01L25/07 ; H02H7/12 ; H01L23/00 ; H01L23/053 ; H01L23/29

Abstract:
A semiconductor module, including: plurality of output elements provided to constitute an upper arm and a lower arm; a resin case provided surrounding an accommodation space for accommodating the output elements; an arm-to-arm wiring line for connecting the upper arm with the lower arm; an output terminal, which is connected to the arm-to-arm wiring line and is for outputting output currents from the output elements to a load being external to the semiconductor module; a sense terminal, which is connected to the arm-to-arm wiring line and is for detecting currents that flow in the output elements; and an inductor provided between a connection point for connecting the arm-to-arm wiring line with the output terminal, and the output terminal is provided. An inductance of the inductor is 1 μH or more.
Public/Granted literature
- US20230163056A1 SEMICONDUCTOR MODULE Public/Granted day:2023-05-25
Information query
IPC分类: