Invention Publication
- Patent Title: SEMICONDUCTOR MODULE
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Application No.: US18159644Application Date: 2023-01-25
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Publication No.: US20230163056A1Publication Date: 2023-05-25
- Inventor: Masayoshi NAKAZAWA
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP 21020737 2021.02.12
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/07 ; H01L23/538 ; H02H7/12

Abstract:
A semiconductor module, including: plurality of output elements provided to constitute an upper arm and a lower arm; a resin case provided surrounding an accommodation space for accommodating the output elements; an arm-to-arm wiring line for connecting the upper arm with the lower arm; an output terminal, which is connected to the arm-to-arm wiring line and is for outputting output currents from the output elements to a load being external to the semiconductor module; a sense terminal, which is connected to the arm-to-arm wiring line and is for detecting currents that flow in the output elements; and an inductor provided between a connection point for connecting the arm-to-arm wiring line with the output terminal, and the output terminal is provided. An inductance of the inductor is 1 μH or more.
Public/Granted literature
- US12199022B2 Semiconductor module Public/Granted day:2025-01-14
Information query
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