- Patent Title: Application-layer connection redistribution among service instances
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Application No.: US18298010Application Date: 2023-04-10
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Publication No.: US12212629B2Publication Date: 2025-01-28
- Inventor: Rajiv Krishan
- Applicant: Oracle International Corporation
- Applicant Address: US CA Redwood City
- Assignee: Oracle International Corporation
- Current Assignee: Oracle International Corporation
- Current Assignee Address: US CA Redwood City
- Main IPC: H04L67/141
- IPC: H04L67/141 ; H04L41/5003 ; H04L67/143

Abstract:
The technology disclosed herein enables redistribution of connections between service instances by determining a subset of the connections and terminating the subset. In a particular example, a method includes determining connection information about connections established with service instances operating in an active-active configuration. The connection information identifies directions of connection initiation for the connections and identifies peers for the connections. Based on the connection information, the method includes determining a subset of the connections for reestablishment on a per-peer basis using direction-dependent criteria and terminating the subset of the connections.
Public/Granted literature
- US20240340346A1 APPLICATION-LAYER CONNECTION REDISTRIBUTION AMONG SERVICE INSTANCES Public/Granted day:2024-10-10
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