Invention Grant
- Patent Title: Semiconductor device having semiconductor column portions
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Application No.: US17868806Application Date: 2022-07-20
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Publication No.: US12302600B2Publication Date: 2025-05-13
- Inventor: Hiroyuki Shimada
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP2021-121035 20210721
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H10D30/63 ; H10D30/67 ; H10D62/10 ; H10D64/20 ; H10D64/23

Abstract:
A semiconductor device includes a plurality of column portions made of a semiconductor. The plurality of column portions each include a source region, a drain region, and a channel formation region including a channel formed between the source region and the drain region. The semiconductor device further includes: a gate electrode provided at a side wall of the channel formation region with an insulating layer being interposed between the gate electrode and the side wall; a first semiconductor layer coupled to either one of the source region and the drain region of each of the plurality of column portions; and a first metal layer coupled to the first semiconductor layer.
Public/Granted literature
- US20230028402A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-01-26
Information query
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