Semiconductor devices and corresponding methods of manufacturing the same are disclosed. For example, a semiconductor device includes a first semiconductor substrate and a second semiconductor substrate. A first portion of a test structure is disposed over the first substrate and a second portion of the test structure is disposed over the second substrate. The test structure includes intentionally offset portions. The performance characteristics of the intestinally offset portions are measured to detect an alignment of the first portion of the test structure and a second portion of the test structure.