Invention Grant
- Patent Title: Variable flow liquid-cooled cooling module
-
Application No.: US17935224Application Date: 2022-09-26
-
Publication No.: US12336138B2Publication Date: 2025-06-17
- Inventor: Harvey J. Lunsman , Tahir Cader
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Spring
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Spring
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.
Public/Granted literature
- US20240107706A1 VARIABLE FLOW LIQUID-COOLED COOLING MODULE Public/Granted day:2024-03-28
Information query