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1.发明授权公开(公告)号：US11800682B2
公开(公告)日：2023-10-24
申请号：US17541477
申请日：2021-12-03
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Tahir Cader
IPC: H05K7/20 , H01L23/46 , H05K1/02 , H01L23/473
CPC classification number: H05K7/20272 , H01L23/473 , H05K1/0203
Abstract: Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.
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公开(公告)号：US11497137B2
公开(公告)日：2022-11-08
申请号：US17126361
申请日：2020-12-18
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Tahir Cader , Harvey J. Lunsman , Mitchell Johnson
Abstract: A compute device includes a printed circuit board, at least three compute subassemblies disposed on the printed circuit board, and a liquid loop. The compute subassemblies disposed on the printed circuit board and each of the three compute subassemblies includes a thermal control plate defining a respective internal conduit therethrough. A temperature controlled liquid circuit circulates through the liquid loop through to control the temperature of each of compute subassemblies in series during operation, the liquid loop including each of the internal conduits in each of the thermal control plates in each of the compute subassemblies.
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公开(公告)号：US20220344239A1
公开(公告)日：2022-10-27
申请号：US17240688
申请日：2021-04-26
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Ernesto Ferrer , Brady Dulian , Steven Dean
IPC: H01L23/373 , H05K1/02
Abstract: Examples described herein relate to a cooling assembly. In some examples, the cooling assembly includes a cooling component and a thermal gap pad disposed in thermal contact with the cooling component. The thermal gap pad includes thermally conductive fabric that is curved at a plurality of locations along one or both of its length or its breadth, wherein a first side of the thermal gap pad is disposed in thermal contact with the cooling component and a second side of the thermal gap pad is disposable in thermal contact with a heat generating component. Certain examples described herein also relate to an electronic circuit module having the cooling assembly.
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公开(公告)号：US11406036B2
公开(公告)日：2022-08-02
申请号：US16682077
申请日：2019-11-13
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Brian T. Purcell , Steven Dean , Harvey J. Lunsman , Jonathan Daniel Befort
Abstract: A flexible input/output (I/O) expansion card connection and communication technique are provided. The flexible I/O expansion card is, in some examples, a mezzanine expansion card that may be a single width mezzanine expansion card, a double width expansion card, or a quad width expansion card. Multiple connectors on a mainboard provide a slot to receive plug in (insertion) of an expansion card. A slot is associated with a communication bus (e.g., Peripheral Component Interconnect (PCI)) established between the expansion card and an associated processor. The expansion card (or more than one expansion card) may be inserted in multiple orientations with respect to the multiple connectors. Automatic adjustment of communication on the communication bus may be implemented via one or more hardware level and/or software assisted translations to allow the mezzanine expansion card to function in a normal or a reverse (180 degrees relative to normal) orientation.
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公开(公告)号：US20210144875A1
公开(公告)日：2021-05-13
申请号：US16682077
申请日：2019-11-13
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Brian T. Purcell , Steven Dean , Harvey J. Lunsman , Jonathan Daniel Befort
Abstract: A flexible input/output (I/O) expansion card connection and communication technique are provided. The flexible I/O expansion card is, in some examples, a mezzanine expansion card that may be a single width mezzanine expansion card, a double width expansion card, or a quad width expansion card. Multiple connectors on a mainboard provide a slot to receive plug in (insertion) of an expansion card. A slot is associated with a communication bus (e.g., Peripheral Component Interconnect (PCI)) established between the expansion card and an associated processor. The expansion card (or more than one expansion card) may be inserted in multiple orientations with respect to the multiple connectors. Automatic adjustment of communication on the communication bus may be implemented via one or more hardware level and/or software assisted translations to allow the mezzanine expansion card to function in a normal or a reverse (180 degrees relative to normal) orientation.
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Patent Agency Ranking
公开(公告)号：US20190029146A1
公开(公告)日：2019-01-24
申请号：US15654132
申请日：2017-07-19
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Bret M. Cuda , Harvey J. Lunsman
IPC: H05K7/20
Abstract: A cooling system for blades of a high performance computer thermally couples blade electronics to the computer's liquid cooling system through one or more heat pipes, without requiring a liquid conduit on, or liquid coupling to, the blade. Moreover, illustrative embodiments allow a blade to be installed in a high performance computer and engage the cooling system without making a liquid connection, and to disengage from the cooling system and be removed from the high performance computer without breaking a liquid connection.
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公开(公告)号：US20240107706A1
公开(公告)日：2024-03-28
申请号：US17935224
申请日：2022-09-26
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Tahir Cader
IPC: H05K7/20
CPC classification number: H05K7/20272 , H05K7/20254 , H05K7/20281 , H05K7/20509
Abstract: Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.
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公开(公告)号：US20220240416A1
公开(公告)日：2022-07-28
申请号：US17155304
申请日：2021-01-22
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Ernesto Ferrer , John Franz
IPC: H05K7/20
Abstract: Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.
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公开(公告)号：US20210282282A1
公开(公告)日：2021-09-09
申请号：US16807807
申请日：2020-03-03
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Michael D. Scott , Alan Doerr , Harvey J. Lunsman
Abstract: A latch assembly includes a latch body, a fastener longitudinally inserted through the latch body, a traveling body, a latch pawl, and a spring device. The fastener includes a head and a shank. The shank includes a thread portion and a second portion, with the second portion disposed between the thread portion and the head. The traveling body is threaded onto the thread portion of the shank such that the traveling body longitudinally traverses the thread portion as the fastener is rotated. The latch pawl is pivotally coupled to the traveling body and pivots while engaging and disengaging the latch body. The spring device is disposed on the shank between the head and the latch body. The spring device surrounds the second portion of the shank.
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公开(公告)号：US10941892B2
公开(公告)日：2021-03-09
申请号：US15789741
申请日：2017-10-20
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Michael Scott , Steven J. Dean , Harvey J. Lunsman
Abstract: Male and female fittings are configured to mate to form a valved connector system. Some embodiments of the female fitting include movable poppet configured to sealingly engage a flared projection within the female fitting. Some embodiments of the male fitting include a male mating aperture, and a movable plug configured to sealingly engage the male mating aperture. When the female fitting is mated with a male fitting, the male fitting forces the poppet to disengage from the flared projection, and the flared projection forces the plug to recede into the male fitting, to open a fluid path through the valved connector system.
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