Invention Grant
- Patent Title: Shielded semiconductor package with open terminal and methods of making
-
Application No.: US18455419Application Date: 2023-08-24
-
Publication No.: US12341108B2Publication Date: 2025-06-24
- Inventor: ChangOh Kim , KyoWang Koo , SungWon Cho , BongWoo Choi , JiWon Lee
- Applicant: STATS ChipPAC Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Atkins and Associates, P.C.
- Agent Brian M. Kaufman; Robert D. Atkins
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/311 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/66
Abstract:
A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.
Public/Granted literature
- US20230402401A1 Shielded Semiconductor Package with Open Terminal and Methods of Making Public/Granted day:2023-12-14
Information query
IPC分类:
