Invention Application
![[PROCESS FOR FABRICATING BUMPS]](/docs/US/2005-01-27/US20050016859A1/abs.jpg.600x600.jpg)
- Patent Title: [PROCESS FOR FABRICATING BUMPS]
- Patent Title (中): [烧制工艺]
-
Application No.: US10710020Application Date: 2004-06-14
-
Publication No.: US20050016859A1Publication Date: 2005-01-27
- Inventor: Min-Lung Huang , Chi-Long Tsai , Chao-Fu Weng , Ching-Huei Su
- Applicant: Min-Lung Huang , Chi-Long Tsai , Chao-Fu Weng , Ching-Huei Su
- Priority: TW92119937 20030722
- Main IPC: C25D5/02
- IPC: C25D5/02 ; C25D5/18 ; H01L21/288 ; H01L21/60 ; H01L23/48
![[PROCESS FOR FABRICATING BUMPS]](/abs-image/US/2005/01/27/US20050016859A1/abs.jpg.150x150.jpg)
Abstract:
A bump fabrication process is provided. A substrate having a plurality of openings of various widths thereon is provided. The substrate is dipped into an electrolytic solution. A step current that increases gradually is provided to the solution to perform an electroplating operation so that the conductive material is deposited inside the openings to form bumps with uniform thickness.
Information query
