Invention Application
- Patent Title: Flexible die heater
- Patent Title (中): 柔性模具加热器
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Application No.: US10726487Application Date: 2003-12-04
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Publication No.: US20050123287A1Publication Date: 2005-06-09
- Inventor: Ramgopal Vissa , Venkata Burada , John Carson
- Applicant: Ramgopal Vissa , Venkata Burada , John Carson
- Applicant Address: US OH Cincinnati
- Assignee: Micropyretics Heaters International, Inc.
- Current Assignee: Micropyretics Heaters International, Inc.
- Current Assignee Address: US OH Cincinnati
- Main IPC: F26B3/30
- IPC: F26B3/30
Abstract:
A novel flexible infrared device is provided for heating surfaces in a uniform manner not available previously. The heater is designed in a manner so as to allow “hugging” of the surface by attaching the heater module to at least two swivel points located above the heating plane. In this manner the common problems encountered with heating dies by IR heaters is overcome.
Public/Granted literature
- US08131138B2 Flexible die heater Public/Granted day:2012-03-06
Information query
IPC分类:
