Invention Application
- Patent Title: Heat spreader with multiple stacked printed circuit boards
- Patent Title (中): 具有多层叠印刷电路板的散热器
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Application No.: US11023213Application Date: 2004-12-22
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Publication No.: US20060133043A1Publication Date: 2006-06-22
- Inventor: Brent Boudreaux , Shaun Harris , Eric Peterson , Christian Belady , Gary Williams , Stuart Haden
- Applicant: Brent Boudreaux , Shaun Harris , Eric Peterson , Christian Belady , Gary Williams , Stuart Haden
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
Public/Granted literature
- US07345885B2 Heat spreader with multiple stacked printed circuit boards Public/Granted day:2008-03-18
Information query
