Abstract:
To provide fault-tolerant, spread spectrum clock signals, a plurality of processing modules having respective spread spectrum control circuits are provided. Clock signals of redundant clock sources are provided to the plurality of processing modules. Failover control logic selects a corresponding one of the clock signals from the redundant clock sources for use in each of the processing modules. Frequency spreading is applied to the corresponding selected clock signal in each of at least some of the plurality of processing module.
Abstract:
To provide fault-tolerant, spread spectrum clock signals, a plurality of processing modules having respective spread spectrum control circuits are provided. Clock signals of redundant clock sources are provided to the plurality of processing modules. Failover control logic selects a corresponding one of the clock signals from the redundant clock sources for use in each of the processing modules. Frequency spreading is applied to the corresponding selected clock signal in each of at least some of the plurality of processing module.
Abstract:
A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
Abstract:
Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.
Abstract:
Various data capture assemblies and methods are provided. In one embodiment, a data capture assembly is provided that includes a bolster plate with an aperture attached to a multi-chip module. A pad array is disposed on the multi-chip module and is exposed through the aperture. An interposer is electrically coupled to the pad array on the multi-chip module, and a translator board is electrically coupled to the interposer. A logical analyzer interface is electrically coupled to the translator board.
Abstract:
In one embodiment, a distributed redundant control signal distribution system comprises a first control signal source co-located with a first set of control signal controlled circuit elements, at least one second control signal source co-located with a second set of control signal controlled circuit elements, at least one controller for providing control signals from the first control signal source to control both the first and second sets of controlled circuit elements, the controller operable for substituting signals from the second control signal source for signals from the first signal control source if the signals from the first control signal source become unavailable to either the first or second circuit elements.
Abstract:
According to at least one embodiment, a system comprises a first device arranged on a circuit board. The system further comprises a programmable capture device arranged on the circuit board, wherein at least one input pin of the programmable capture device is communicatively coupled to at least one signal pin of the first device such that the programmable capture device captures at least one signal from the first device during testing of the first device.
Abstract:
A power supply system and method are disclosed that may incorporate a plurality of cascading power units arranged in parallel, a connection interface between the plurality of cascading power units and an electronic load, wherein the connection interface prevents current from entering one of the plurality of cascading power units from another of the plurality, and wherein each one of the plurality of cascading power units has a maximum effective output voltage greater than a next one of said plurality.
Abstract:
Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.