Invention Application
US20070023979A1 Method for the production of semiconductor granules 有权
半导体颗粒的生产方法

  • Patent Title: Method for the production of semiconductor granules
  • Patent Title (中): 半导体颗粒的生产方法
  • Application No.: US10553049
    Application Date: 2004-04-09
  • Publication No.: US20070023979A1
    Publication Date: 2007-02-01
  • Inventor: Alain Straboni
  • Applicant: Alain Straboni
  • Priority: FR03/04675 20030414
  • International Application: PCT/FR04/50152 WO 20040409
  • Main IPC: B28B1/14
  • IPC: B28B1/14 B28B3/02 B28B3/00
Method for the production of semiconductor granules
Abstract:
The invention relates to a method for the production of semiconductor granules comprising a step in which semiconductor powders are sintered and/or melted. The powders are nanometric and/or micrometric sized
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