Invention Application
- Patent Title: PACKAGE SUBSTRATE
- Patent Title (中): 包装基板
-
Application No.: US11533765Application Date: 2006-09-20
-
Publication No.: US20080036058A1Publication Date: 2008-02-14
- Inventor: David C. H. Cheng
- Applicant: David C. H. Cheng
- Applicant Address: TW Taoyuan
- Assignee: UNIMICRON TECHNOLOGY CORP.
- Current Assignee: UNIMICRON TECHNOLOGY CORP.
- Current Assignee Address: TW Taoyuan
- Priority: TW95129187 20060809
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A package substrate including a circuit board, a reinforcing plate and at least one conductive channel is provided. A first surface of the reinforcing plate is disposed on the circuit board for resisting the warpage of the circuit board. The reinforcing plate has an opening corresponding to a first contact of the circuit board exposed thereon. In addition, one end of the conductive channel is located in the opening and electrically connected to the first contact, and the other end of the conductive channel is located on a second surface of the reinforcing plate to form a bonding pad.
Public/Granted literature
- US07772703B2 Package substrate Public/Granted day:2010-08-10
Information query
IPC分类:
