Invention Application
- Patent Title: Nanoscopic Assurance Coating for Lead-Free Solders
- Patent Title (中): 无铅焊料纳米保护涂层
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Application No.: US11839462Application Date: 2007-08-15
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Publication No.: US20080075872A1Publication Date: 2008-03-27
- Inventor: Joseph Lichtenhan , Andre Lee , Sukhendu Hait
- Applicant: Joseph Lichtenhan , Andre Lee , Sukhendu Hait
- Main IPC: C08G77/00
- IPC: C08G77/00 ; B05D3/02
Abstract:
Nanoscopic silicon containing agents including polyhedral oligomeric silsesquioxane and polyhedral oligomeric silicate are used to eliminate the formation of conductive metal whiskers at the surface of lead-free solders joints and atom migration in semiconductors.
Information query
