Invention Application
- Patent Title: HIGHLY CONDUCTIVE COMPOSITION FOR WAFER COATING
- Patent Title (中): 用于水性涂料的高导电组合物
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Application No.: US11941498Application Date: 2007-11-16
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Publication No.: US20080166543A1Publication Date: 2008-07-10
- Inventor: Qizhuo Zhuo
- Applicant: Qizhuo Zhuo
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B32B5/16
Abstract:
A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260 ° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.
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