公开(公告)号：US20080164612A1

公开(公告)日：2008-07-10

申请号：US11651719

申请日：2007-01-10

Applicant: Qizhuo Zhuo

Inventor： Qizhuo Zhuo

IPC: H01L23/48 ,  H01L21/44

CPC classification number: C09J5/06 ,  C09J9/02 ,  C09J2201/602 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512

Abstract: A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.

公开(公告)号：US20080166543A1

公开(公告)日：2008-07-10

申请号：US11941498

申请日：2007-11-16

Applicant: Qizhuo Zhuo

Inventor： Qizhuo Zhuo

IPC: H01L21/00 ,  B32B5/16

CPC classification number: C09J5/06 ,  C09J9/02 ,  C09J2201/602 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512

Abstract: A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260 ° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.

Abstract translation: 用于涂覆半导体晶片的导电组合物包括具有小于2微米的平均粒度和小于10微米的最大粒度的导电填料，第一树脂的软化点在80-260℃之间，溶剂 ，固化剂和第二树脂，其中在室温下第一树脂基本上可溶于溶剂。

公开(公告)号：US07422707B2

公开(公告)日：2008-09-09

申请号：US11651719

申请日：2007-01-10

Applicant: Qizhuo Zhuo

Inventor： Qizhuo Zhuo

IPC: H01B1/00 ,  H01B1/12

CPC classification number: C09J5/06 ,  C09J9/02 ,  C09J2201/602 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512

Abstract: A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.

Abstract translation: 用于涂覆半导体晶片的导电组合物包括具有小于2微米的平均粒度和小于10微米的最大粒度的导电填料，第一树脂的软化点在80-260℃之间，溶剂 ，固化剂和第二树脂，其中在室温下第一树脂基本上可溶于溶剂。

公开(公告)号：US6162849A

公开(公告)日：2000-12-19

申请号：US228265

申请日：1999-01-11

Applicant: Qizhuo Zhuo ,  Ronald M. Harris ,  Dennis C. Skovran ,  Leo F. Lightner ,  Michael S. Randall ,  Vernon E. Stygar

Inventor： Qizhuo Zhuo ,  Ronald M. Harris ,  Dennis C. Skovran ,  Leo F. Lightner ,  Michael S. Randall ,  Vernon E. Stygar

IPC: C08K3/38 ,  C08L67/06

CPC classification number: C08K3/38 ,  C08K2003/385

Abstract: This invention relates to a thermally conductive moldable polymer blend comprising a thermoplastic polymer having a tensile at yield of at least 10,000 psi; at least 60% by weight of a mixture of boron nitride powders having an average particle size of at least 50 microns; and a coupling agent. The composition displays a thermal conductivity of at least about 15 W/m.degree. K and it is capable of being molded using high speed molding techniques such as injection molding.

Abstract translation: 本发明涉及一种导热可成型聚合物共混物，其包含热塑性聚合物，其收率为至少10,000psi; 至少60重量％的平均粒度为至少50微米的氮化硼粉末的混合物; 和偶联剂。 该组合物显示出至少约15W / m℃K的热导率，并且其能够使用高速成型技术（例如注射成型）成型。