Invention Application
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US12216567Application Date: 2008-07-08
-
Publication No.: US20090014799A1Publication Date: 2009-01-15
- Inventor: Atsuo Isobe
- Applicant: Atsuo Isobe
- Applicant Address: JP Atsugi-shi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi
- Priority: JP2007-181762 20070711
- Main IPC: H01L27/08
- IPC: H01L27/08 ; H01L21/30

Abstract:
A semiconductor device and a method for manufacturing a semiconductor device are provided. A semiconductor device comprises a first single-crystal semiconductor layer including a first channel formation region and a first impurity region over a substrate having an insulating surface, a first gate insulating layer over the first single-crystal semiconductor layer, a gate electrode over the first gate insulating layer, a first interlayer insulating layer over the first gate insulating layer, a second gate insulating layer over the gate electrode and the first interlayer insulating layer, and a second single-crystal semiconductor layer including a second channel formation region and a second impurity region over the second gate insulating layer. The first channel formation region, the gate electrode, and the second channel formation region are overlapped with each other.
Public/Granted literature
- US08049253B2 Semiconductor device and method for manufacturing the same Public/Granted day:2011-11-01
Information query
IPC分类: