Invention Application
- Patent Title: TEST SOCKET AND TEST MODULE
- Patent Title (中): 测试插座和测试模块
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Application No.: US12253872Application Date: 2008-10-17
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Publication No.: US20100052721A1Publication Date: 2010-03-04
- Inventor: Chiu-Fang Chang
- Applicant: Chiu-Fang Chang
- Priority: TW097132854 20080828
- Main IPC: G01R31/28
- IPC: G01R31/28
Abstract:
The present invention discloses a test socket for testing an image sensor that comprises a sensing area facing a light source. The test socket comprises a signal-connecting mechanism for transmitting a signal between the image sensor and a source of the test signal, a bearing layer having an opening and being arranged at the surface facing the light source, and a transparent layer arranged between the image sensor and the bearing layer for supporting the image sensor.
Information query
