公开(公告)号：US08009896B2

公开(公告)日：2011-08-30

申请号：US12073285

申请日：2008-03-04

Applicant: Chiu-Fang Chang

Inventor： Chiu-Fang Chang

IPC: G06K9/00

CPC classification number: G01B11/306

Abstract: A coplanarity inspection device for a printed circuit board includes a base, a supporting disk, a driver, a printed circuit board, a light source, an image acquisition means, and a controller. The supporting disk is arranged on the base, and the driver rotates the supporting disk. The printed circuit board is placed on the supporting disk, and includes a to-be measured side facing downward. The light source projects light beams on the to-be measured side of the printed circuit board. The image acquisition means aims at a specific area of the to-be measured side for image acquisition. The controller is to control the driver, and to store image taken by the image acquisition means. As such, the coplanarity inspection device for a printed circuit board can be employed to inspect whether the coplanarity of the printed circuit board satisfies the standard of setting values in a certain range.

Abstract translation: 用于印刷电路板的共平面检查装置包括基座，支撑盘，驱动器，印刷电路板，光源，图像获取装置和控制器。 支撑盘布置在基座上，驱动器旋转支撑盘。 印刷电路板被放置在支撑盘上，并且包括朝向下方的待测量侧。 光源将待测光侧的光束投射到印刷电路板的一侧。 图像获取装置针对要被测量侧的特定区域进行图像采集。 控制器是控制驱动器，并存储由图像获取装置拍摄的图像。 因此，可以使用用于印刷电路板的共面性检查装置来检查印刷电路板的共面性是否满足一定范围内的设定值的标准。

公开(公告)号：US20100052721A1

公开(公告)日：2010-03-04

申请号：US12253872

申请日：2008-10-17

Applicant: Chiu-Fang Chang

Inventor： Chiu-Fang Chang

IPC: G01R31/28

CPC classification number: G01R1/0433

Abstract: The present invention discloses a test socket for testing an image sensor that comprises a sensing area facing a light source. The test socket comprises a signal-connecting mechanism for transmitting a signal between the image sensor and a source of the test signal, a bearing layer having an opening and being arranged at the surface facing the light source, and a transparent layer arranged between the image sensor and the bearing layer for supporting the image sensor.

Abstract translation: 本发明公开了一种用于测试图像传感器的测试插座，其包括面向光源的感测区域。 测试插座包括用于在图像传感器和测试信号源之间传输信号的信号连接机构，具有开口并布置在面向光源的表面的轴承层，以及布置在图像之间的透明层 传感器和支撑图像传感器的轴承层。

公开(公告)号：US20090243644A1

公开(公告)日：2009-10-01

申请号：US12142675

申请日：2008-06-19

Applicant: Chiu-Fang Chang

Inventor： Chiu-Fang Chang

IPC: G01R31/28

CPC classification number: G01R1/0466 ,  G01J1/04 ,  G01J1/0403 ,  G01J1/08

Abstract: The present invention relates to a socket, test device and test method for testing electronic element packages with leads, and particularly relates to a socket, test device and test method for testing image sensors with leads. The test device comprises a socket, a plurality of test probes and a test circuit board. The socket comprises a base having a plurality of first holes, a guiding structure having a plurality of second holes and at least one floating member used to connect the base and the guiding structure. In the socket, test device and test method of the present invention, each test probe is received into one first hole and one second hole to maintain the top surface of guiding structure to be even for preventing the deflective placing of the electronic element packages, and for preventing the damage to the test probes. The test probes are controlled by compressing the floating member for protruding form the top surface of the guiding structure and for providing a shorter delivering path of the electronic signals between the test circuit board and the electronic element packages. This shorter delivering path of the electronic signals can improve the accuracy and reliability of the test process for the electronic element packages with leads.

Abstract translation: 本发明涉及一种用引线测试电子元件封装的插座，测试装置和测试方法，特别涉及用于测试具有引线的图像传感器的插座，测试装置和测试方法。 测试装置包括插座，多个测试探针和测试电路板。 插座包括具有多个第一孔的底座，具有多个第二孔的引导结构和用于连接底座和引导结构的至少一个浮动构件。 在本发明的插座，测试装置和测试方法中，每个测试探针被接收到一个第一孔和一个第二孔中，以将引导结构的顶表面保持均匀以防止电子元件封装的偏转放置，以及 以防止对测试探针的损坏。 测试探针通过压缩浮动构件来控制，用于从导向结构的顶表面突出，并且用于在测试电路板和电子元件封装之间提供较短的电子信号传送路径。 电子信号的这种较短的输送路径可以提高具有引线的电子元件封装的测试过程的准确性和可靠性。

公开(公告)号：US07737711B2

公开(公告)日：2010-06-15

申请号：US12170316

申请日：2008-07-09

Applicant: Chiu-Fang Chang

Inventor： Chiu-Fang Chang

IPC: G01R1/073

CPC classification number: G01R1/06722 ,  G01R1/06738

Abstract: A pogo-type probe to be installed in a probe socket and a probe card for testing chip scale package of a semiconductor device is characterized in that the pogo probe has a hollow main body for receiving at least one resilient element internally and the main body comprises two end portions disposed with a first probe head and a second probe head respectively, wherein each of the probe heads is composed of a plurality of taper members to form a crown shape, and each of the taper members has an individual chamfer so that each chamfer has a tip to contact each contact pad of the semiconductor device under test for chip scale package.

Abstract translation: 要安装在探针插座中的pogo型探针和用于测试半导体器件的芯片级封装的探针卡的特征在于，pogo探针具有中空主体，用于在内部容纳至少一个弹性元件，并且主体包括 两个端部分别设置有第一探头和第二探针头，其中每个探头由多个锥形构件组成以形成冠形，并且每个锥形构件具有单独的倒角，使得每个倒角 具有与芯片级封装的待测半导体器件的每个接触焊盘接触的尖端。

公开(公告)号：US20100126755A1

公开(公告)日：2010-05-27

申请号：US12369665

申请日：2009-02-11

Applicant: Chiu-Fang Chang

Inventor： Chiu-Fang Chang

IPC: H01B5/00

CPC classification number: H01B5/02

Abstract: The present invention relates to an electric conductor with large current capability and a method for enhancing current capability of an electric conductor, and particularly relates to a test probe with good current capability and a method for improving the current capability of a test probe. In the present invention, dents are formed on the surface of an electric conductor to make the surface rough, so that the electric conductor can have a greater surface area. The larger surface area of the electric conductor provides more paths for passage of the electric current in order to improve the current capability of the electric conductor.

Abstract translation: 本发明涉及具有大电流能力的电导体和提高电导体电流能力的方法，特别涉及具有良好电流能力的测试探针和提高测试探针电流能力的方法。 在本发明中，在电导体的表面上形成凹痕以使表面粗糙，使得导电体具有更大的表面积。 电导体的较大的表面积为电流的通过提供了更多的路径，以便改善电导体的电流能力。