Invention Application
US20110051351A1 Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board
审中-公开
电路板，包括其的半导体器件，存储器模块，存储器系统以及电路板的制造方法
- Patent Title: Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board
- Patent Title (中): 电路板，包括其的半导体器件，存储器模块，存储器系统以及电路板的制造方法
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Application No.: US12805264Application Date: 2010-07-21
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Publication No.: US20110051351A1Publication Date: 2011-03-03
- Inventor: Shiro Harashima
- Applicant: Shiro Harashima
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Priority: JP2009-194143 20090825
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H01R12/30 ; H05K7/02
Abstract:
A circuit board according to the present invention includes a main surface, a back surface parallel to the main surface, a side surface positioned between edges of the main surface and the back surface, and first and second board terminals covering a portion of the main surface and a portion of the side surface, respectively. According to the present invention, because the board terminals are provided not only on the main surface but also on the side surface of the circuit board, the total number of board terminals can be increased while maintaining sufficient pitch and width of the board terminals.
Information query
