Invention Application
- Patent Title: SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND PLATED THROUGH-HOLE
- Patent Title (中): 半导体芯片组件与后/基热扩散器和通孔
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Application No.: US13078928Application Date: 2011-04-02
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Publication No.: US20110175136A1Publication Date: 2011-07-21
- Inventor: Charles W.C. Lin , Chia-Chung Wang
- Applicant: Charles W.C. Lin , Chia-Chung Wang
- Main IPC: H01L33/64
- IPC: H01L33/64
Abstract:
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.
Public/Granted literature
- US08129742B2 Semiconductor chip assembly with post/base heat spreader and plated through-hole Public/Granted day:2012-03-06
Information query
IPC分类:
