Invention Application
- Patent Title: METHOD FOR MANUFACTURING OPTICAL PRINTED CIRCUIT BOARD
- Patent Title (中): 制造光学印刷电路板的方法
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Application No.: US13584759Application Date: 2012-08-13
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Publication No.: US20130230650A1Publication Date: 2013-09-05
- Inventor: BING-HENG LEE
- Applicant: BING-HENG LEE
- Applicant Address: TW Tu-Cheng
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW Tu-Cheng
- Priority: TW101107004 20120302
- Main IPC: B05D5/06
- IPC: B05D5/06

Abstract:
A method for manufacturing an optical printed circuit board (OPCB) includes: providing a substrate having a loading surface; forming a first cladding solvent layer on the loading surface by a spin coating method; solidifying the first cladding solvent layer to form a first cladding layer; forming a core solvent layer on the first cladding layer through the spin coating method; solidifying the core solvent layer to form a core layer; forming optical waveguide patterns on the core layer by a roller pressing method; forming a second cladding solvent layer on the core layer through the spin coating method; and solidifying the second cladding solvent layer to form the second cladding layer.
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