公开(公告)号：US08873902B2

公开(公告)日：2014-10-28

申请号：US13600225

申请日：2012-08-31

Applicant: Bing-Heng Lee

Inventor： Bing-Heng Lee

IPC: G02B6/00 ,  G02B6/36

CPC classification number: G02B6/4214 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/428

Abstract: An optical transmission module includes a printed circuit board (PCB) including a first surface and an opposite second surface, a ceramic substrate mounted on the first surface, a light emitting diode and a photodiode carried on the ceramic substrate, an optical printed circuit board (OPCB) mounted on the second surface, a first reflective unit and, and a second reflective unit. The OPCB includes a flexible substrate which carries a first planar optical wave guide corresponding the first reflective unit and a second planar optical wave guide corresponding the second reflective unit. The PCB defines a first through hole aligned with the light emitting diode and the first reflective unit and a second through hole aligned with the photodiode and the second reflective unit.

Abstract translation: 光传输模块包括：印刷电路板（PCB），包括第一表面和相对的第二表面;安装在第一表面上的陶瓷基板，发光二极管和陶瓷基板上携带的光电二极管，光学印刷电路板 OPCB），第一反射单元和第二反射单元。 OPCB包括柔性基板，其承载对应于第一反射单元的第一平面光波导和对应于第二反射单元的第二平面光波导。 PCB限定了与发光二极管和第一反射单元对准的第一通孔和与光电二极管和第二反射单元对准的第二通孔。

公开(公告)号：US08831434B2

公开(公告)日：2014-09-09

申请号：US13531386

申请日：2012-06-22

Applicant: Bing-Heng Lee

Inventor： Bing-Heng Lee

IPC: H04B10/00

CPC classification number: H04B10/801

Abstract: A computer data transmission system includes a CPU, a photoelectrical conversion module electrically connected to the CPU, a plurality of I/O interface cards, and a plurality of first optical fibers. The photoelectrical conversion module includes a plurality of photoelectrical conversion units. Each I/O interface card includes at least one photoelectrical conversion unit for converting electrical signals to optical signals or converting optical signals to electrical signals. The first optical fibers connect the photoelectrical conversion units of the I/O interface cards and the photoelectrical conversion units of the photoelectrical conversion module. The photoelectrical conversion unit of the photoelectrical conversion module receives electrical signals outputted by the CPU, and convert the electrical signals to optical signals. The converted optical signals are transmitted to the photoelectrical conversion unit of the I/O interface card, and the photoelectrical conversion unit of the I/O interface card converts the optical signals to electrical signals.

Abstract translation: 计算机数据传输系统包括CPU，电连接到CPU的光电转换模块，多个I / O接口卡和多个第一光纤。 光电转换模块包括多个光电转换单元。 每个I / O接口卡包括至少一个光电转换单元，用于将电信号转换成光信号或将光信号转换成电信号。 第一根光纤连接I / O接口卡的光电转换单元和光电转换模块的光电转换单元。 光电转换模块的光电转换单元接收由CPU输出的电信号，并将电信号转换为光信号。 转换的光信号被传送到I / O接口卡的光电转换单元，I / O接口卡的光电转换单元将光信号转换成电信号。

公开(公告)号：US20130294721A1

公开(公告)日：2013-11-07

申请号：US13600225

申请日：2012-08-31

Applicant: BING-HENG LEE

Inventor： BING-HENG LEE

IPC: G02B6/12

CPC classification number: G02B6/4214 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/428

Abstract: An optical transmission module includes a printed circuit board (PCB) including a first surface and an opposite second surface, a ceramic substrate mounted on the first surface, a light emitting diode and a photodiode carried on the ceramic substrate, an optical printed circuit board (OPCB) mounted on the second surface, a first reflective unit and, and a second reflective unit. The OPCB includes a flexible substrate which carries a first planar optical wave guide corresponding the first reflective unit and a second planar optical wave guide corresponding the second reflective unit. The PCB defines a first through hole aligned with the light emitting diode and the first reflective unit and a second through hole aligned with the photodiode and the second reflective unit.

Abstract translation: 光传输模块包括：印刷电路板（PCB），包括第一表面和相对的第二表面;安装在第一表面上的陶瓷基板，发光二极管和陶瓷基板上携带的光电二极管，光学印刷电路板 OPCB），第一反射单元和第二反射单元。 OPCB包括柔性基板，其承载对应于第一反射单元的第一平面光波导和对应于第二反射单元的第二平面光波导。 PCB限定了与发光二极管和第一反射单元对准的第一通孔和与光电二极管和第二反射单元对准的第二通孔。

公开(公告)号：US20130236087A1

公开(公告)日：2013-09-12

申请号：US13534188

申请日：2012-06-27

Applicant: BING-HENG LEE ,  KUO-FONG TSENG

Inventor： BING-HENG LEE ,  KUO-FONG TSENG

IPC: G01R31/26 ,  G06K9/62 ,  G06F19/00

CPC classification number: G01R31/2601 ,  G01R31/2635

Abstract: In a testing method for a laser diode (LD) die, a sequence of current values of electric current increasing with a fixed increment is calculated. Then, control parameters are obtained. The electric current is applied to the LD die according to the control parameters. A sequence of voltage values across the LD die and a sequence of power values of light emitted form the LD die are measured according to the control parameters. A table and a graph are generated using the sequence of current values, the sequence of voltage values, and the sequence of power values. Both of the table and the graph indicate an electro-optical property of the LD die. Next, whether the LD die is qualified is determined based upon the table, the graph, and a predetermined electro-optical property.

Abstract translation: 在激光二极管（LD）裸片的测试方法中，计算出以固定增量增加的电流的电流值序列。 然后，获得控制参数。 根据控制参数将电流施加到LD管芯。 根据控制参数测量LD裸片上的电压值序列和从LD芯片发射的光的功率值序列。 使用当前值序列，电压值序列和功率值序列生成表格和图形。 表和曲线图均表示LD模具的电光特性。 接下来，基于表格，曲线图和预定的电光学特性来确定LD模具是否合格。

公开(公告)号：US20130230275A1

公开(公告)日：2013-09-05

申请号：US13584757

申请日：2012-08-13

Applicant: Bing-Heng LEE

Inventor： Bing-Heng LEE

IPC: G02B6/12 ,  B05D5/06 ,  B05C11/00 ,  B05C1/00

CPC classification number: G02B6/138 ,  G02B2006/12097

Abstract: An optical printed circuit board (OPCB) includes a rigid substrate, a first cladding layer, a core layer, and a second cladding layer. The first cladding layer is formed on the substrate, the core layer is formed on the first cladding layer, and the second cladding layer is formed on the core layer. The core layer defines optical waveguide patterns. The refractive rate of the core layer is greater than the refractive rate of the first cladding layer and the refractive rate of the second cladding layer.

Abstract translation: 光学印刷电路板（OPCB）包括刚性基板，第一包层，芯层和第二包覆层。 第一包层形成在基板上，芯层形成在第一包层上，第二包覆层形成在芯层上。 核心层定义了光波导图案。 芯层的折射率大于第一包层的折射率和第二包层的折射率。

公开(公告)号：US20130159570A1

公开(公告)日：2013-06-20

申请号：US13426922

申请日：2012-03-22

Applicant: BING-HENG LEE

Inventor： BING-HENG LEE

IPC: G06F13/38

CPC classification number: H04B10/801

Abstract: A computer data transmitting system includes a PCI-E interface, a CPU, a first photoelectric conversion module, and a second photoelectric conversion module. The first photoelectric conversion module is electrically connected to the PCI-E interface. The second photoelectric conversion module is electrically connected to the CPU. The first photoelectric conversion module and the second photoelectric conversion module are connected to each other by at least one optical fiber. A motherboard using the computer data transmitting system is also provided.

Abstract translation: 计算机数据发送系统包括PCI-E接口，CPU，第一光电转换模块和第二光电转换模块。 第一光电转换模块电连接到PCI-E接口。 第二光电转换模块电连接到CPU。 第一光电转换模块和第二光电转换模块通过至少一根光纤相互连接。 还提供了使用计算机数据传输系统的主板。

公开(公告)号：US20130148974A1

公开(公告)日：2013-06-13

申请号：US13531386

申请日：2012-06-22

Applicant: BING-HENG LEE

Inventor： BING-HENG LEE

IPC: H04B10/00

CPC classification number: H04B10/801

Abstract: A computer data transmission system includes a CPU, a photoelectrical conversion module electrically connected to the CPU, a plurality of I/O interface cards, and a plurality of first optical fibers. The photoelectrical conversion module includes a plurality of photoelectrical conversion units. Each I/O interface card includes at least one photoelectrical conversion unit for converting electrical signals to optical signals or converting optical signals to electrical signals. The first optical fibers connect the photoelectrical conversion units of the I/O interface cards and the photoelectrical conversion units of the photoelectrical conversion module. The photoelectrical conversion unit of the photoelectrical conversion module receives electrical signals outputted by the CPU, and convert the electrical signals to optical signals. The converted optical signals are transmitted to the photoelectrical conversion unit of the I/O interface card, and the photoelectrical conversion unit of the I/O interface card converts the optical signals to electrical signals.

Abstract translation: 计算机数据传输系统包括CPU，电连接到CPU的光电转换模块，多个I / O接口卡和多个第一光纤。 光电转换模块包括多个光电转换单元。 每个I / O接口卡包括至少一个光电转换单元，用于将电信号转换为光信号或将光信号转换成电信号。 第一根光纤连接I / O接口卡的光电转换单元和光电转换模块的光电转换单元。 光电转换模块的光电转换单元接收由CPU输出的电信号，并将电信号转换为光信号。 转换的光信号被传送到I / O接口卡的光电转换单元，I / O接口卡的光电转换单元将光信号转换成电信号。

公开(公告)号：US20120162616A1

公开(公告)日：2012-06-28

申请号：US13048883

申请日：2011-03-16

Applicant: BING-HENG LEE ,  YI-ZHONG SHEU ,  TAI-CHERNG YU

Inventor： BING-HENG LEE ,  YI-ZHONG SHEU ,  TAI-CHERNG YU

IPC: G03B21/14

CPC classification number: G03B21/2086 ,  G03B21/145 ,  G03B21/2033

Abstract: A projector includes a case, a projection lens, a shielding plate, and a controller received in the case. The case includes a sidewall defining an aperture. The projection lens is used for projecting a cone of light rays which passes through the aperture and a projection area. The shield plate is positioned on the sidewall. The driver is used for driving the shield plate to any of desired positions ranging from a first position in which the shield plate exposes the aperture to a second position in which the shield plate shields the aperture. The barrier detection device is used for generating a first signal if detecting no barrier presents in the projection area and generating a second signal if detecting a barrier presents in the projection area. The controller is used for controlling the driver to drive the shield plate to the first position if receiving the first signal.

Abstract translation: 投影仪包括壳体，投影透镜，屏蔽板和在壳体中接收的控制器。 壳体包括限定孔的侧壁。 投影透镜用于投射通过孔径的光线和投影区域。 屏蔽板位于侧壁上。 驱动器用于将屏蔽板驱动到从屏蔽板暴露孔的第一位置到屏蔽板屏蔽孔的第二位置的任何期望位置。 如果检测到投影区域中没有屏障存在并且如果检测到投影区域中存在的屏障则产生第二信号，则用于产生第一信号的屏障检测装置。 如果接收到第一信号，控制器用于控制驱动器将屏蔽板驱动到第一位置。

公开(公告)号：US09170370B2

公开(公告)日：2015-10-27

申请号：US13584762

申请日：2012-08-13

Applicant: Bing-Heng Lee

Inventor： Bing-Heng Lee

IPC: G02B6/12 ,  G02B6/42 ,  G02B6/43

CPC classification number: G02B6/12002 ,  G02B6/4214 ,  G02B6/43

Abstract: An optical printed circuit board includes a substrate, a first cladding layer, a core layer, and a second cladding layer. The first cladding layer is formed on the substrate and defines a receiving groove. The core layer is received in the receiving groove. The second cladding layer is formed on the core layer. The refractive index of the core layer is greater than that of the first cladding layer and that of the second cladding layer. The core layer includes a bottom surface, a first refractive surface, and a second refractive surface. An included angle between the bottom surface and the first refractive surface is about 135 degrees. An included angle between the bottom surface and the second refractive surface is about 135 degrees.

Abstract translation: 光学印刷电路板包括基板，第一包层，芯层和第二包覆层。 第一覆层形成在基板上并限定接收槽。 芯层容纳在接收槽中。 第二覆层形成在芯层上。 芯层的折射率大于第一包层和第二包层的折射率。 芯层包括底表面，第一折射表面和第二折射表面。 底表面和第一折射表面之间的夹角为约135度。 底表面和第二折射表面之间的夹角为约135度。

公开(公告)号：US08750658B2

公开(公告)日：2014-06-10

申请号：US13458407

申请日：2012-04-27

Applicant: Bing-Heng Lee

Inventor： Bing-Heng Lee

IPC: G02B6/42

CPC classification number: G02B6/4206 ,  B29D11/00663 ,  G02B6/1221 ,  G02B6/4214 ,  G02B6/43

Abstract: An optical coupling module includes a substrate, a circuit board defining two through holes, an optical waveguide positioned between the substrate and the circuit board, and an optical assembly. The optical waveguide includes a core and a clad, each core comprises two coupling surfaces corresponding to the two through holes. At least one coupling surfaces is in an arcuate shape. The clad covers the core, except for the two coupling surfaces exposing out of the clad. The optical assembly formed on the circuit board comprises an optical emitting element and an optical receiving element. The optical emitting element and the optical receiving element are positioned above the two through holes, respectively. Light emitted from the optical emitting element enters the optical waveguide via one of the coupling surface, and leaves from another coupling surface to reach the optical receiving element. The coupling surface is capability of focusing light.

Abstract translation: 光耦合模块包括基板，限定两个通孔的电路板，位于基板和电路板之间的光波导和光学组件。 光波导包括芯和包层，每个芯包括对应于两个通孔的两个耦合表面。 至少一个联接表面是弧形的。 除了从包层外露出的两个耦合表面外，包层覆盖芯。 形成在电路板上的光学组件包括光发射元件和光接收元件。 光发射元件和光接收元件分别位于两个通孔的上方。 从光发射元件射出的光通过耦合面中的一个进入光波导，从另一耦合面离开到达光接收元件。 耦合面是聚光的能力。