Invention Application
- Patent Title: MEMS Device Structure and Methods of Forming Same
- Patent Title (中): MEMS器件结构及其形成方法
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Application No.: US13450223Application Date: 2012-04-18
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Publication No.: US20130277777A1Publication Date: 2013-10-24
- Inventor: Chang-Chia Chang , Chen-Chih Fan , Bruce C.S. Chou
- Applicant: Chang-Chia Chang , Chen-Chih Fan , Bruce C.S. Chou
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L21/58
- IPC: H01L21/58 ; H01L29/84
Abstract:
A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.
Public/Granted literature
- US09139420B2 MEMS device structure and methods of forming same Public/Granted day:2015-09-22
Information query
IPC分类:
