Abstract:
The present invention provides a MEMS structure comprising confined sacrificial oxide layer and a bonded Si layer. Polysilicon stack is used to fill aligned oxide openings and MEMS vias on the sacrificial layer and the bonded Si layer respectively. To increase the design flexibility, some conductive polysilicon layer can be further deployed underneath the bonded Si layer to form the functional sensing electrodes or wiring interconnects. The MEMS structure can be further bonded to a metallic layer on top of the Si layer and the polysilicon stack.
Abstract:
A stray-light-coupled biometrics sensing module includes a light-transparent body, a display unit and an optical module. The light-transparent body has a front side and a backside. The front side is configured to support an organic object thereon. The display unit attached to the backside of the light-transparent body displays a frame. The optical module is attached to the backside of the light-transparent body through an adhesive, and is disposed adjacent to the display unit. First light rays of the frame emitted from an eye-viewing screen couple into the organic object through the light-transparent body. After travelling a short distance in the organic object, the first light rays couple out of the organic object and re-enter the light-transparent body as second light rays entering the optical module. The optical module senses the second light rays to generate a biometrics image signal. An electronic apparatus is also disclosed.
Abstract:
A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.
Abstract:
An electronic apparatus includes a module and a biometrics sensor. The module has an exposed surface and an unexposed surface. The biometrics sensor has an embedded sensing surface. The embedded sensing surface is joined to the unexposed surface of the module so that a portion of the exposed surface corresponding to a contact portion between the embedded sensing surface and the unexposed surface serves as an exposed sensing surface for sensing biometrics information.
Abstract:
A portable encrypted storage device with biometric identification includes a host interface connected to a terminal host, a controller connected to the host interface, a memory module, a fingerprint sensor, an encryption/decryption chip and a portable large-capacity storage unit connected to the controller. The controller communicates with the host by handshakes and enables the host to automatically run a fingerprint identification driver and application program from the memory module to the host. The host receives an instruction from the user through the driver and program, and informs the controller to control the fingerprint sensor to read to-be-recognized fingerprint data of the user. The host judges whether or not the to-be-recognized fingerprint data substantially matches with a fingerprint template stored in the memory module. If a match occurs, the host can recognize and access the hidden portable large-capacity storage unit through the encryption/decryption chip.
Abstract:
A capacitive sensing array device of an electronic apparatus includes sensing electrodes, a shielding conductor layer, a coupling signal source, a constant voltage source and switch modules. The coupling signal source provides a coupling signal coupled to an object. The constant voltage source provides a constant voltage to the shielding conductor layer to form a stable vertical parasitic capacitor between the shielding conductor layer and each sensing electrode. Each switch module is electrically connected to the constant voltage source via the corresponding sensing electrode. When one sensing electrode is selected to perform sensing, the corresponding switch module is configured as an open-circuited state such that the selected sensing electrode is disconnected from the constant voltage source, while the other sensing electrodes are electrically connected to the constant voltage source to form a stable horizontal parasitic capacitor between the selected sensing electrode and the other sensing electrodes.
Abstract:
A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane.
Abstract:
An electronic apparatus with a hidden sensor guiding indication includes a housing, a display, a biometrics sensor and a processor. The display is visually disposed in the housing. The biometrics sensor, hidden in the housing and disposed beside the display, senses a biometrics message of a user. The processor, disposed in the housing and electrically connected to the display and the biometrics sensor, controls operations of the display and the biometrics sensor. In a sensing mode, the processor controls the display to display a guiding message to instinctively guide the user to operate the hidden biometrics sensor, disposed beside the display, to sense the biometrics message. An instinctive guiding method is also disclosed.
Abstract:
In a fingerprint apparatus, fingerprint sensing members disposed on a silicon substrate detect skin textures of a finger placed thereon to generate electric signals. A set of integrated circuits formed on the substrate processes the electric signals. First bonding pads are disposed on the substrate and electrically connected to the set of integrated circuits. A first insulating layer is disposed below the first bonding pads. Metal plugs penetrating through the substrate are respectively electrically connected to the first bonding pads. A second insulating layer is formed on the substrate and between the metal plugs and the substrate. Second bonding pads are formed on a rear side of the second insulating layer, and are respectively electrically connected to the first bonding pads through the metal plugs. The protection layer is disposed on the substrate and covers the sensing members to form a flat touch surface to be touched by the finger.
Abstract:
A fingerprint sensing device includes a chip substrate, a plurality of first connecting pads and a flexible printed circuit board. The chip substrate has a plurality of fingerprint sensing cells. The first connecting pads are respectively disposed on the fingerprint sensing cells and exposed from a top surface of the chip substrate. The flexible printed circuit board is disposed above the chip substrate and has a plurality of signal transmission structures exposed from a bottom surface of the flexible printed circuit board. The fingerprint sensing cells are respectively electrically connected to the signal transmission structures, and a top surface of the flexible printed circuit board serves as a contact surface for a finger so that sensed fingerprint signals of the finger are transmitted to the fingerprint sensing cells through the signal transmission structures. A method of manufacturing the fingerprint sensing device is also disclosed.