Invention Application
- Patent Title: PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US14300795Application Date: 2014-06-10
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Publication No.: US20150016082A1Publication Date: 2015-01-15
- Inventor: Jae Soo LEE
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2013-0080440 20130709
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11
Abstract:
A printed circuit board includes an insulating layer; a via in the insulating layer, a first circuit layer formed at a first side of the insulating layer and having a portion buried in the via; a second circuit layer formed at a second side of the insulating layer and electrically connected with the portion of the first circuit layer in the via.
Information query
