公开(公告)号：US20140076959A1

公开(公告)日：2014-03-20

申请号：US14030460

申请日：2013-09-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yeo Park ,  Jae Soo LEE

IPC: B23K1/20 ,  B23K3/08

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K3/0638 ,  B23K3/08 ,  B23K2101/42

Abstract: Disclosed herein are a solder paste print squeegee and a method of using the same. The solder paste print squeegee includes: a rotation module driven rotatably; a pair of rods coupled with the rotation module in parallel; a squeegee holder coupled with the lower ends of the pair of rods and having a trapezoid shape; and a pair of squeegee blades supported by the squeegee holder.

Abstract translation: 这里公开了焊膏印刷刮板及其使用方法。 焊膏印刷刮板包括：可旋转地驱动的旋转模块; 一对与所述旋转模块并联的杆; 与所述一对杆的下端连接并具有梯形形状的刮板保持架; 以及由刮板支架支撑的一对刮刀。

公开(公告)号：US20150016082A1

公开(公告)日：2015-01-15

申请号：US14300795

申请日：2014-06-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Soo LEE

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/115 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1533 ,  H05K1/111 ,  H05K1/144 ,  H05K3/0038 ,  H05K3/0097 ,  H05K3/025 ,  H05K3/428 ,  H05K3/4682 ,  H05K2201/042 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/10666 ,  H05K2203/1536 ,  H01L2924/013 ,  H01L2924/00014

Abstract: A printed circuit board includes an insulating layer; a via in the insulating layer, a first circuit layer formed at a first side of the insulating layer and having a portion buried in the via; a second circuit layer formed at a second side of the insulating layer and electrically connected with the portion of the first circuit layer in the via.

Abstract translation: 印刷电路板包括绝缘层; 在所述绝缘层中的通孔，形成在所述绝缘层的第一侧并具有埋在所述通孔中的部分的第一电路层; 形成在所述绝缘层的第二侧并与所述通孔中的所述第一电路层的所述部分电连接的第二电路层。